| 摘要 |
A method for manufacturing a wiring substrate 1 includes a conductor layer forming step for forming a second conductor layer 29, through electroless copper plating and copper electroplating, on a first resin dielectric layer 7, which is surface-roughened to a predetermined roughness and to which palladium adheres; a cyan treatment step for cleaning a substrate 41 on which the second conductor layer 29 is formed, using a cyanide-containing solution; and an upper resin dielectric layer forming step for forming a second resin dielectric layer 9 on the first resin dielectric layer 7 and the second conductor layer 29 of the cyan-treated substrate 41.
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