发明名称 |
Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
摘要 |
A semiconductor package singulation process is disclosed. The process comprises the step of using at least a portion of a reference fiducial formed on at least one package in a semiconductor package panel comprising a plurality of interconnected packages, the fiducial used to monitor and to control the semiconductor package singulation process.
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申请公布号 |
US6744134(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20020037205 |
申请日期 |
2002.01.04 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
ROBERTS JAY;CHAPMAN GREGORY M.;VANNORTWICK JOHN;DRUSSEL ZANE;MODEN WALTER L;MUNTIFERING TOM A |
分类号 |
H01L23/544;H05K1/02;H05K3/00;(IPC1-7):H01L23/043 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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