发明名称 |
Substrate treatment process and apparatus |
摘要 |
A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time.
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申请公布号 |
US6743301(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20000742423 |
申请日期 |
2000.12.22 |
申请人 |
M&CIRCLESOLID,FSI LTD. |
发明人 |
MATSUNO KOUSAKU;IGA MASAO |
分类号 |
B08B3/12;H05K3/26;(IPC1-7):B08B3/00 |
主分类号 |
B08B3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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