发明名称 Substrate treatment process and apparatus
摘要 A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time.
申请公布号 US6743301(B2) 申请公布日期 2004.06.01
申请号 US20000742423 申请日期 2000.12.22
申请人 M&CIRCLESOLID,FSI LTD. 发明人 MATSUNO KOUSAKU;IGA MASAO
分类号 B08B3/12;H05K3/26;(IPC1-7):B08B3/00 主分类号 B08B3/12
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