发明名称 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same |
摘要 |
An adhesive film for semiconductor comprises a support film, and adhesive layers formed on both surfaces of the support film, in which each adhesive layer comprises an adhesive having a glass transition temperature of 200° C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 mum. A lead frame for semiconductor comprises a lead frame and an adhesive film for semiconductor according to the present invention. A semiconductor device comprises a lead frame and a semiconductor element, in which the lead frame and the semiconductor element are adhered to each other via an adhesive film for semiconductor according to the present invention. |
申请公布号 |
US6744133(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20020212264 |
申请日期 |
2002.08.06 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TANABE YOSHIYUKI;MATSUURA HIDEKAZU |
分类号 |
C09J7/02;C09J163/00;C09J201/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/06;H01L23/48;H01L23/52;H01L23/28;H01L23/34;H01L23/10;H01L29/40 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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