发明名称 |
Balancing planarization of layers and the effect of underlying structure on the metrology signal |
摘要 |
One embodiment of the present invention is a method of designing underlying structures in a wafer with pads of varying sizes and varying loading factors, and selecting the design of pads that yield a reflected metrology signal closest to the calibration metrology signal and that meet preset standard planarization characteristics. Another embodiment is a method of designing underlying structures with random shapes of varying sizes and varying loading factors. Still another embodiment is the use of periodic structures of varying line-to-space ratios in one or more underlying layers of a wafer, the periodicity of the underlying periodic structure being positioned at an angle relative to the direction of periodicity of the target periodic structure of the wafer.
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申请公布号 |
US6743646(B2) |
申请公布日期 |
2004.06.01 |
申请号 |
US20010035925 |
申请日期 |
2001.10.22 |
申请人 |
TIMBRE TECHNOLOGIES, INC. |
发明人 |
JAKATDAR NICKHIL;NIU XINHUI |
分类号 |
G01N21/47;G01N21/95;G01N21/956;H01L21/3105;H01L23/58;(IPC1-7):H01L21/66;G01R31/26 |
主分类号 |
G01N21/47 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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