发明名称 JET SOLDER FEEDING DEVICE AND SOLDERING METHOD
摘要 A JET SOLDER FEEDING DEVICE ALLOWING THE MOLTEN SOLDER EJECTED FROM EJECTING FROM PORTS TO BE KEPT AT A DESIRED HEIGHT IN A STABLE MANNER. IN THE JET SOLDER FEEDING DEVICE IN WHICH THE MOLTEN SOLDER (J) IS EJECTED AND FED FROM MULTIPLE EJECTING PORTS (22) FORMED ON A CORRUGATED PLATE (21), EACH WALL PORTION (22A) SURROUNDING THE MULTIPLE EJECTING PORTS (22) FORMED ON THE CORRUGATED PLATE (21) IS PROJECTED UPWORD BY COINING. THIS CONFIGURATION ALLOWS THE MOLTEN SOLDER (J) INTRODUCED UNDER THE CORRUGATED PLATE (21) TO BE SATISFACTORILY GUIDED BY THE WALL PORTION (22A) WHICH SURROUNDS EACH EJECTING PORT (22) AND IS PROJECTED UPWARD. THUS THE MOLTEN SOLDER (J) EJECTED FROM THE EJECTING PORTS (22) CAN BE KEPT AT DESIRED HEIGHT, AND IN ADDITION, ITS STATE IS SATISFACTORILY MAINTAINED IN A STABLE MANNER.
申请公布号 MY117223(A) 申请公布日期 2004.05.31
申请号 MYPI20002362 申请日期 2000.05.26
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MASUO KOSHI;TADAHIKO SUGIMOTO;HIROAKI NAKAYAMA;KENICHIROU TODOROKI
分类号 B23K1/00;H05K3/34;B05B1/14;B05C3/18;B05C11/10;B23K1/08;B23K3/06;B23K31/00 主分类号 B23K1/00
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