SEMICONDUCTOR CHIP PACKAGE LOADING/UNLOADING APPARATUS WITH SOCKET PRESSING PLATE

摘要

PURPOSE: A semiconductor chip package loading/unloading apparatus is provided to prolong the lifetime of a burn-in socket and to reduce the process time of chip package loading/unloading by using a socket pressing plate with a plurality of guide holes corresponding to burn-in sockets. CONSTITUTION: A plurality of burn-in sockets(120) are installed on a burn-in board(130). Each burn-in socket includes a recess on the top. An X-Y table(160) capable of moving to X and Y directions is used for loading the burn-in board. A socket pressing plate(250) with a plurality of guide holes(253) corresponding to each recess of the sockets is installed over the X-Y table to press simultaneously the sockets. A plurality of driving tools(140a,140b) are used for loading and unloading semiconductor chips to and from sockets.