发明名称 DUAL-SOURCE, SINGLE-CHAMBER METHOD AND APPARATUS FOR SPUTTER DEPOSITION
摘要 The present invention relates to a dual-source, single-chamber method and apparatus for epitaxial sputter deposition of epilayers and high quality films. The apparatus for performing the method includes a first sputtering source (2) for the sputtering of an epitaxial film on a substrate (6). A second sputtering source 4 is for the sputtering of reactive materials to create a getter on a cryogenic shroud (8). The first sputtering source (4) and the substrate (6) are surrounded by the cryogenic shroud (8).
申请公布号 KR20040044994(A) 申请公布日期 2004.05.31
申请号 KR20047004398 申请日期 2002.09.27
申请人 发明人
分类号 C23C14/34;C23C14/56;C30B23/02;H01J37/34 主分类号 C23C14/34
代理机构 代理人
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