| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC coin of high quality to the surface of which appropriate printing or engraving can be applied by thinning the coin while securing desired massiveness, and to provide the manufacturing method thereof. SOLUTION: This IC coin is provided with: a high specific gravity plate which is composed of a high specific gravity resin material whose specific gravity is increased by mixing a high specific gravity material in a resin material and which is formed in a plate shape; an IC mounting base material on which electronic circuits for data communications and data recording are mounted; and a coin base provided with a loading surface for loading the high specific gravity plate and the IC mounting base material. The outer peripheral edge part on the open surface side of the high specific gravity plate and the IC mounting base material loaded on the coin base is coated with the resin material to obtain a coin shape. |
