| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of an integrated circuit by a method wherein an interconnection layer is not separated in a wire bonding operation and a circuit inspection. SOLUTION: In an integrated circuit, a circuit chip and an interconnection layer 107 which comprises pad parts W1, W2, W3 by which the circuit chip and other external components are wire-bonded are formed on a semiinsulating semiconductor substrate 104. In the integrated circuit, the interconnection layer at the pad parts is bonded to a semiconductor active layer 110 on the semiconductor substrate 104 via a reinforcement layer 109 which has been reacted with the semiconductor substrate by an alloying treatment. |
