| 摘要 |
The present invention provides with a conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure throughout, and a production method of producing a fine metal component having good properties. <??>A conductive paste is such that metal powder having the form of fine metal particles being linked in a chain shape is blended. A conductive film is such that chain-shaped metal powder having paramagnetism is oriented in a constant direction by applying a magnetic filed to a coating film by the application of the conductive past. A plating method grows a plated coating by electroplating on the conductive film made of the conductive paste. A production method of a fine metal component which selectively grows a plated coating 4' on a conductive film 1 exposed at a portion of a fine pass-hole pattern in a mold 3 to product a fine metal component. <IMAGE> |
