Electrical connection formation method for ultrasonic piezoelectric transducer, involves mounting acoustic baking layer on transducer array whose elements are electrically separated for allowing individual electrical connection

摘要

An acoustic backing preform having an array of holes is formed. An electrically conductive film is deposited onto the one side of acoustic backing preform and onto the surfaces of the holes, to form a acoustic backing layer (14). The backing layer is mounted on a transducer array whose elements are electrically separated to allow individual electrical connection. The array of holes comprise first and second rows of holes. They further comprise the steps of attaching two printed circuits to the relatively thick layer of acoustically attenuating material. The conductive traces of the first printed circuit is in contact with the relatively thin layers of electrically conductive material deposited in respective holes of said first row and with conductive traces of the second printed circuit in contact with the relatively thin layers of electrically conductive material deposited in respective holes of the second row. Independent claims are also included for the following: (1) method of manufacturing ultrasonic transducer; and (2) ultrasonic transducer.