ELECTRO-CONDUCTIVE METAL PLATED POLYIMIDE SUBSTRATE COMPRISING POLYIMIDE MEMBRANE AND CONDUCTIVE METAL MEMBRANE

摘要

PURPOSE: Provided is an electro-conductive metal plated polyimide substrate which has a lower metal layer having an alkali-resistance and a surface conductive metal layer having no etching solution-resistance. CONSTITUTION: The electro-conductive metal plated polyimide substrate comprises an aromatic polyimide substrate; a Mo-Ni alloy lower metal layer comprising Mo and Ni in a weight ratio of 75/25 to 99/1; and a plated conductive membrane. The Mo-Ni alloy lower metal layer comprises Mo and Ni in a weight ratio of 75/25 to 95/5. The conductive metal comprises copper. The aromatic polyimide substrate has a plasma treated surface and the surface comes in contact with the lower metal layer.