发明名称 |
HIGH PRESSURE COMPATIBLE VACUUM CHECK FOR SEMICONDUCTOR WAFER INCLUDING LIFT MECHANISM |
摘要 |
A vacuum chuck fir holding a semiconductor wafer during high pressure processing comprises a wafer platen, first through third lift pins, and an actuator mechanism. The wafer platen comprises a smooth surface, first through third lift pin holes, and a vacuum opening. In use, the vacuum opening applies vacuum to a surface of a semiconductor wafer, which chucks the semiconductor wafer to the wafer platen. The first through third lift pins mount within the first of third lift pin holes, respectively. The actuator mechanism couples the first through third lifting pins to the wafer platen. The actuator mechanism couples the first through third lifting pins to the wafer platen. The actuator mechanism operates to extend the first through third lift pins in unison above the smooth surface of the wafer platen. The actuator mechanism operates to retract the first through third lift pins in unison to at least flush with the smooth surface of the wafer platen. |
申请公布号 |
WO2004044953(A2) |
申请公布日期 |
2004.05.27 |
申请号 |
WO2003US35017 |
申请日期 |
2003.11.03 |
申请人 |
SUPERCRITICAL SYSTEMS INC. |
发明人 |
SUTTON, THOMAS, R.;BIBERGER, MAXIMILIAN, A. |
分类号 |
B25B11/00;H01L21/683;H01L21/687 |
主分类号 |
B25B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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