发明名称 |
B-stageable die attach adhesives |
摘要 |
The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry. |
申请公布号 |
US2004102566(A1) |
申请公布日期 |
2004.05.27 |
申请号 |
US20030459601 |
申请日期 |
2003.06.12 |
申请人 |
HENKEL LOCTITE CORPORATION |
发明人 |
FORRAY DEBORAH DERFELT;LIU PUWEI;SANTOS BENEDICTO DELOS |
分类号 |
C09J5/06;H01L21/58;(IPC1-7):C08K3/00 |
主分类号 |
C09J5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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