| 发明名称 |
APPARATUS FOR AND METHOD OF WAFER GRINDING |
| 摘要 |
<p>An apparatus (10) for wafer grinding includes sensors (38) and a spectral analyzer to perform a spectral analysis of light received by the sensors (38) during grinding of a semiconductor wafer (12). Based on the spectral analysis, the grinding process is stopped or the force applied to the semiconductor wafer is modified. This in situ monitoring decreases breakage and overheating of the semiconductor wafer (12).</p> |
| 申请公布号 |
WO2004043647(A1) |
申请公布日期 |
2004.05.27 |
| 申请号 |
WO2003US30589 |
申请日期 |
2003.09.23 |
| 申请人 |
MOTOROLA, INC., A CORPORATION OF THE STATE OF DELAWARE |
发明人 |
SCHNEEGANS, MANFRED;ROESNER, NICHAEL;WALLIS, DAVID |
| 分类号 |
B24B7/22;B24B13/00;B24B49/00;B24B49/12;B24B49/16;B24B51/00;(IPC1-7):B24B7/22 |
主分类号 |
B24B7/22 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
