| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which is easily connected to an optical fiber and excellent in optical coupling efficiency. <P>SOLUTION: The semiconductor light emitting device is composed of a semiconductor light emitting chip made of an n-type semiconductor layer and a p-type semiconductor layer laminated on the one main surface of a substrate with a pair of opposed main surfaces and a package equipped with a housing hole where the light emitting chip is housed. The housing hole serves also as an insertion hole for the optical fiber, a positive and a negative lead electrode are provided on the bottom of the insertion hole, and the semiconductor light emitting chip is connected face-down to the bottom of the insertion hole with its other main surface up. The optical fiber is inserted into the insertion hole, the end face of the optical fiber is abutted against the substrate, and thus the semiconductor light emitting chip and the optical fiber are connected together. <P>COPYRIGHT: (C)2004,JPO |
