| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic wiring board in which a solder bridging can be prevented effectively without sacrifice of reliability in solder bonding of pads. SOLUTION: In order to surface mounting an electronic component 100 through a solder joint 102, the ceramic wiring board 2 is provided, on the major surface of a board body 3, in a form where a plurality of board side terminal pads 155 conducting with metal wiring layers are arranged respectively. The board side terminal pads 155 are buried in a surface dielectric layer 250, i.e. a ceramic dielectric layer forming the surface part of the board body 3, such that the major surface P1 of the pad is recessed from the major surface of the surface dielectric layer 250. A recess 251 for exposing the major surface of the board side terminal pad 155 is opened in the major surface of the surface dielectric layer 250 at a position corresponding to the board side terminal pad and filled with the solder joint 102 conducting with the board side terminal pad 155. The major surface of the board side terminal pad 155 is covered with metal plating layers 155n and 155a only at the exposed part 256 in the recess 251. COPYRIGHT: (C)2004,JPO |
