| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilevel interconnection substrate for mounting an electronic component which is superior in productivity. <P>SOLUTION: This method for manufacturing the multilevel interconnection substrate for mounting the electronic component includes: a step for laminating a plurality of wiring substrates containing an insulation resin layer and an interlayer connecting conductive post joined to an external connecting pad, on a reel-like supporting base material on which the external connecting pad is formed; and a step for heating the multilevel interconnection substrate in which a plurality of wiring substrates are laminated. Further, these steps are performed on the continuous supporting base materials. <P>COPYRIGHT: (C)2004,JPO</p> |
