| 摘要 |
PROBLEM TO BE SOLVED: To provide an atmospheric CVD device which is simple in structure and capable of decreasing the thickness variation of a CVD film formed on the whole surface of a wafer to 5% or below. SOLUTION: In the atmospheric CVD device 10 dispersion heads 13, 16, and 19 are equipped with dedicated transfer belts 12, 15, and 18, respectively, and each of the transfer belts 12, 15, and 18 is made to cross its preceding transfer belt at a prescribed angle. The wafer 11 is transferred from one transfer belt to another transfer belt successively, but the wafer 11 keeps its orientation unchanged. When the wafer 11 is transferred from one transfer belt to another transfer belt, an angle formed by the wafer 11 with the dispersion head is changed by a cross angle at which two transfer belts cross each other. COPYRIGHT: (C)2004,JPO |
