发明名称 FLUX FOR SOLDERING CIRCUIT BOARD, SOLDER PASTE AND CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a flux that does not generate a phenomenon of chip rising even by soldering using an non-leaded solder, hardly cause thermal deterioration in residual film, and prevents erroneous judgment even in an inspection with an image inspection machine, and to provide a solder paste. SOLUTION: The flux for soldering a circuit board is a flux used for soldering an electronic component onto the circuit board containing a polybutadiene-based high molecular compound. The solder paste for soldering the circuit board uses the flux. The circuit board before or after mounting the electronic part has the residual films. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004152936(A) 申请公布日期 2004.05.27
申请号 JP20020315559 申请日期 2002.10.30
申请人 TAMURA KAKEN CO LTD 发明人 FUJIMORI KENJI;SHIGA EISUKE;MINEGISHI KUNIHIKO;ONO TAKAO
分类号 B23K35/22;B23K35/26;B23K35/363;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K35/22
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