| 摘要 |
A method for eliminating noise interference and acoustic noise by a printed circuit board ground plane layout is disclosed. The method is applied to a circuit system having multiple outputs, wherein the circuit system has a first power converting module, a second power converting module and a printed circuit board. The first power converting module and the second power converting module respectively includes a first ground pin group and a second ground pin group. The method includes the steps of (a) connecting each ground pin of the first ground pin group to a respective solder point and connecting each solder point to a first node, and connecting each ground pin of the second ground pin group to a respective solder point and connecting each solder point to a second node, and (b) connecting the first node and the second node to a common node and connecting the common node to a solder point of a common ground terminal on the printed circuit board ground plane.
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