SPUTTERING TARGET AND POWDER FOR PRODUCTION THEREOF

摘要

An Sb-Te base sputtering target of 20 mum or less average crystal grain diameter, 60 MPa or greater deflective strength and 1000 ppm or less oxygen content. In particular, an Sb-Te base sputtering target that at the time of sputtering, enables effectively inhibiting particle occurrence, abnormal electrical discharge, nodule occurrence, target cracking or breakage, etc. and enables reducing the amount of oxygen contained in the target; a process for producing the same; and powder for sintering which is suitable for production of the sputtering target.