| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having high sensitivity and high resolution and causing little reduction of the film in an unexposed part after development. <P>SOLUTION: The positive photosensitive resin composition is characterized by containing: (A) a polyamide resin; (B) a compound which generates an acid by light; (C) a specified compound; and (D) a solvent. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004151611(A) |
申请公布日期 |
2004.05.27 |
| 申请号 |
JP20020319309 |
申请日期 |
2002.11.01 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
MAKABE HIROAKI;BANBA TOSHIO;HIRANO TAKASHI |
| 分类号 |
G03F7/039;C08G69/26;G03F7/037;G03F7/075;H01L21/027 |
主分类号 |
G03F7/039 |
| 代理机构 |
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