| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal abrasive compound that prevents dishing to improve evenness, improves a grinding speed of a metal film, specifically a copper film to enable high-speed grinding under low pressure, enhances a production yield and is inexpensive and further is contributive to industry. <P>SOLUTION: The metal abrasive compound is used for grinding the metal film and contains a film forming compound for being polymerized to a metal film surface to form a polymerized film on the metal film surface. Further, in a metal film grinding method, the metal film is ground to make the metal film even by using the metal abrasive compound. The substrate fabricating method includes a process in which the metal film is ground to be made even by the metal film grinding method. The metal film is formed on the substrate with recesses to fill the recesses so as to cover the recesses. <P>COPYRIGHT: (C)2004,JPO</p> |
