发明名称 SUBSTRATE INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an integrated substrate inspection apparatus which is automated and carries out all of EBR/EEW inspection, pattern defect inspection, and reticle error inspection on a substrate. SOLUTION: A first image acquiring section 110 acquires a first image of the edge of a substrate, while a second image acquiring section 120 acquires a second image on the patterns of the substrate. The first image is acquired from the substrate held on a first stage 160, while the second image is acquired from the substrate held on a second stage 170. A transfer robot 180 transfers the substrate from the first stage 160 to the second stage 170. An image processing section 140 carries out the EBR/EEW inspection on the substrate based on the first image, and carries out the pattern defect inspection and the reticle error inspection based on the second image. Since various inspection steps of the substrate are carried out with the integrated substrate inspection apparatus 100, the efficiency of the substrate inspection steps is enhanced, and reliability of the various substrate inspection steps is enhanced. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004153264(A) 申请公布日期 2004.05.27
申请号 JP20030355452 申请日期 2003.10.15
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHOI SUN-YONG;KIM KWANG SU;KIM JOO-WOO;CHOI JEONG-HYUN;PARK DONG-JIN;JUN CHUNG-SAM
分类号 G01N21/01;G01N21/84;G01N21/95;G01N21/956;H01L21/00;H01L21/027;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01N21/01
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