| 发明名称 |
Surface-mounted device has solder pre-form around each connector pin for assembly on printed circuit board via through-hole-reflow technique |
| 摘要 |
<p>The surface-mounted device (1) has a housing (2) provided with a mounting surface (3) having a number of projecting connector pins (4), each enclosed by a solder pre-form (6) fitted into a recess (5) formed in the mounting surface around each connector pin.</p> |
| 申请公布号 |
DE20220761(U1) |
申请公布日期 |
2004.05.27 |
| 申请号 |
DE2002220761U |
申请日期 |
2002.07.03 |
| 申请人 |
HARTMANN CODIER GMBH & CO.KG |
发明人 |
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| 分类号 |
H05K3/34;(IPC1-7):H05K1/18 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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