| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide nonaqueous liquid which can maintain proper viscosity and form a semiconductor film with superior uniformity, adhesive strengths, porosity, and other properties after baking when a semiconductor film is formed on a transparent conductive substrate by a doctor blade method, a screen printing method, etc. <P>SOLUTION: The coating liquid for semiconductor film formation is prepared by mixing 30 to 2,000 mass pts. alkylene glycol, polyalkylene glycol, or alkyl ether thereof as a dispersant with 100 mass pts. metal oxide semiconductor powder. <P>COPYRIGHT: (C)2004,JPO |
