RESIN SEALING APPARATUS FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a means which can prevent the deformation and displacement of a frame by preventing the concentration of load on a specific fixed pin when resin-sealing a semiconductor device by a resin sealing apparatus. SOLUTION: In the resin sealing apparatus, pushing springs 14 for pushing fixed pins 6 downward are installed between a slide plate 7 and the fixed pins 6. The pushing springs 14 are flexible in accordance with a thickness of the frame 12, hence reducing variations in pushing force among the fixed pins 6 when the thickness of the frame 12 is different at different positions of the fixed pins 6, or even when some of the fixed pins are worn out or the like and get shorter. COPYRIGHT: (C)2004,JPO