ELECTRICALLY-CONDUCTIVE PARTICULATE AND SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an electrically-conductive particulate which is capable of bonding well an electric-pole substrate with such an element as a semiconductor chip or electric-pole substrates each other by means of such an electrically-conductive connection method as a ball grip array or a flip chip and which is excellent in the elasticity, and to provide a substrate having the electrically-conductive connection by using it and having none of the connection failure caused by a thermal cycling. SOLUTION: The electrically-conductive particulate has a metallic plating layer with the solder-wettability on the surface of the particulate of the base material made of a resin. COPYRIGHT: (C)2004,JPO