| 摘要 |
In one embodiment there is provided a motherboard assembly. The motherboard assembly comprises a motherboard substrate; a conductive circuit on a first side of the motherboard substrate comprising an interface to connect the conductive circuit to an electrical component; and a power leveling element aligned with the interface and mounted to a second side of the motherboard substrate opposite the first side, the power leveling element being to level power delivery from the interface.
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