MULTILAYER CIRCUIT BOARD FOR HIGH FREQUENCY WAVE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer circuit board for a high frequency wave which has a small size and in which a production cost can be suppressed to low.

SOLUTION: A cutout 2 partly opened at one end face of a rectangular laminate 1 is formed on an upper surface of the laminate 1 formed by laminating a plurality of dielectric layers 1a-1f. A piezoelectric element 3 is placed on the surface of the dielectric layer exposed to a forming region of the cutout 2. This element 3 is hermetically sealed by a cover member 4 made of a metal mounted in the forming region of the cutout 2.

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