| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate on which a buildup multilayer wiring layer provided with a fine wiring excellent in high-frequency characteristics is formed, and to provide the manufacturing method of the same. <P>SOLUTION: The multilayer wiring substrate is provided with a core substrate, and buildup wiring layers consisting of a wiring layer and an insulating layer and which are formed on one or both sides of the core substrate through the insulating layer. The core substrate is provided with a plurality of conductive units, through which the surface of the core substrate is communicated with the backside of the same by a conductive material. The thermal expansion coefficient of the core substrate in X-Y direction is 2-20ppm while the core material of the core substrate is selected from a composite material of silicon, ceramics, glass and glass-epoxy. Further, the insulating layer of the buildup wiring layer is made of a photosensitive resin which can be cured thermally at a temperature not higher than 250°C. <P>COPYRIGHT: (C)2004,JPO</p> |
