| 摘要 |
PROBLEM TO BE SOLVED: To connect highly accurately a plurality of probe pins to a semiconductor wafer. SOLUTION: This probe card to be electrically connected to an electronic device is equipped with a probe pin to be electrically connected to the electronic device, a holding substrate for holding the probe pin, and a temperature changing part for changing a temperature of the back of a facing surface to be faced to the electronic device on the holding substrate in the approaching direction to the temperature of the facing surface. The probe pin is electrically connected to the electronic device at the other end to one end held by the holding substrate, and the direction from one end toward the other end of the probe pin may be approximately parallel to the direction from the holding substrate toward the electronic device. COPYRIGHT: (C)2004,JPO
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