| 摘要 |
PROBLEM TO BE SOLVED: To change the arrangement of bonding pads simply and accurately. SOLUTION: On a die pad 31, a plurality of semiconductor chips 40A-1 and 40A-2 each having a plurality of first bonding pads 41, respectively, are fixed. On the semiconductor chips 40A-1 and 40A-2, a relay chip 50F is fixed via an insulator 45. The relay chip 50F has a plurality of second and third bonding pads 51, and the plurality of bonding pads 51 are connected to each other in a wiring pattern 52F having a single-layer wiring structure or a multilayer wiring structure, changing the arrangement of the bonding pads 41 at the side of the semiconductor chips 40A-1 and 40A-2 into a different orientation. The first bonding pads 41 are connected to the second bonding pads 51 by first wires 61 and the third bonding pads 51 are connected to bonding pads 33 at the side of a lead frame 30 by second wires 62. COPYRIGHT: (C)2004,JPO
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