| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can be developed with an aqueous sodium hydroxide solution, aqueous sodium carbonate solution and an aqueous alkaline solution, such as tetramethylammonium hydroxide (TMAH), can form fine images by exposure with low energy, and develops excellent heat resistance, adhesiveness to conductors, electrical characteristics, etc., while having good flexibility and flexuousness, as film characteristics after imidization by post-development heat treatment. <P>SOLUTION: The photosensitive resin composition contains (A) a polyamide acid, (B) a compound having photopolymerizable double bonds, (C) a photopolymerization initiator, and (D) a copolymer of the compound having the photopolymerizable double bonds and a bifunctional compound. <P>COPYRIGHT: (C)2004,JPO |
