发明名称 METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE AND MULTI-LAYER COPPER-CLAD LAMINATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper-clad laminate capable of decreasing the generation of inferiority caused by wrinkles in a thin copper foil. <P>SOLUTION: In the method for manufacturing the copper-clad laminate, the copper foil 1 having a thickness of≤12μm is laminated on one surface or both surfaces of a prepreg 2, heated, pressed and laminated for molding the copper-clad laminate. The prepreg 2 with a charge amount of static electricity of≤2 kV is used. The influence on the thin copper foil 1 with a thickness of≤12μm caused by static electricity becomes sufficiently small, and the generation of inferiority caused by wrinkles can be decreased. In addition, it is unnecessary to apply an external force such as tension or the like to the copper foil 1 to smooth out the wrinkles, and the damage of the copper foil is eliminated. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004148543(A) 申请公布日期 2004.05.27
申请号 JP20020313390 申请日期 2002.10.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 HIGASHIDA TOSHIYUKI;SAGARA TAKASHI
分类号 B32B15/08;B29C43/18;B29L31/34;B32B37/00;B32B37/16;H05K3/00;H05K3/46;(IPC1-7):B32B15/08;B32B31/04;B29D9/00 主分类号 B32B15/08
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