| 摘要 |
PROBLEM TO BE SOLVED: To improve the facility efficiency and the space efficiency of a manufacturing line by making a chip to bond to both opposed surfaces of a substrate by a single bonding apparatus. SOLUTION: The bonding apparatus 10 includes an imaging unit 20 for capturing the images of the chip 2 and the substrate 1 held in first and second bonding heads 14, 15; a moving unit 30 for selectively invading the imaging unit 20 between the first bonding head 14 and the substrate 1 positioned at opposite positions of the first surface of the substrate 1, or between the second bonding head 15 and the substrate 1 positioned at the opposite positions of the second surface of the substrate 1; and an image processing unit 40 for detecting the relative positions of the chip 2 and the substrate 1 based on image data captured by the imaging unit 20. COPYRIGHT: (C)2004,JPO |
