| 摘要 |
PROBLEM TO BE SOLVED: To eliminate failure when transferring a wiring circuit layer and suppress delamination of the wiring circuit layer even after baking in the process that the wiring circuit layer is formed with the transfer from a transfer sheet to the surface of a ceramic green sheet. SOLUTION: A multilayer wiring substrate can be manufactured by preparing a transfer sheet 4 which is configured by forming the wiring circuit layer consisting of a metal foil on the surface of the transfer sheet 4, transferring and forming the wiring circuit layer 3 to the surface of a ceramic green sheet 1 from the transfer sheet 4, laminating a plurality layers of the green sheet 1, and baking the wiring circuit layer 3 at the temperature lower than the melting point of a metal used to form the wiring circuit layer 3. In this method, after the surface of the wiring circuit layer 3 on the transfer sheet 4 is irradiated with the plasma, a pattern is transferred to the surface of the green sheet 1. COPYRIGHT: (C)2004,JPO |
