发明名称 SUBSTRATE WITH SLOT, AND FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a slotted substrate having desired characteristics. SOLUTION: In the forming method of a liquid supply slot, a hard mask 504 full for exposing a first region 510 of a first substrate surface 310 is pattern formed on the first surface 310, and a slot part 610 is formed in a substrate 306 to penetrate a smaller part than the whole of the first region 510 of the first surface 310. The forming method includes formation of the slot part 610 to have a smaller section than the section of the first region 510 at the first surface 310, and etching of the substrate 306 to form a fluid handling slot 304 by removing a material from in the first region 510 after the formation of the slot part 610. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004148824(A) 申请公布日期 2004.05.27
申请号 JP20030369822 申请日期 2003.10.30
申请人 HEWLETT-PACKARD DEVELOPMENT CO LP 发明人 DONALDSON JEREMY;TRUNINGER MARTHA A;OBERT JEFFREY S
分类号 B41J2/175;B41J2/14;B41J2/16;B41J2/19;(IPC1-7):B41J2/175 主分类号 B41J2/175
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