发明名称 |
SUBSTRATE WITH SLOT, AND FORMING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a slotted substrate having desired characteristics. SOLUTION: In the forming method of a liquid supply slot, a hard mask 504 full for exposing a first region 510 of a first substrate surface 310 is pattern formed on the first surface 310, and a slot part 610 is formed in a substrate 306 to penetrate a smaller part than the whole of the first region 510 of the first surface 310. The forming method includes formation of the slot part 610 to have a smaller section than the section of the first region 510 at the first surface 310, and etching of the substrate 306 to form a fluid handling slot 304 by removing a material from in the first region 510 after the formation of the slot part 610. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004148824(A) |
申请公布日期 |
2004.05.27 |
申请号 |
JP20030369822 |
申请日期 |
2003.10.30 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT CO LP |
发明人 |
DONALDSON JEREMY;TRUNINGER MARTHA A;OBERT JEFFREY S |
分类号 |
B41J2/175;B41J2/14;B41J2/16;B41J2/19;(IPC1-7):B41J2/175 |
主分类号 |
B41J2/175 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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