| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding liquid crystal substrates with which the number of positioning times is reduced and tact time for bonding the liquid crystal substrates is shortened. SOLUTION: The method for bonding the liquid crystal substrates is applied to an apparatus to contain an upper surface plate with an upper substrate, to which a positioning mark is imparted, sucked therewith and a lower surface plate with a lower substrate, to which a positioning mark is imparted alike, sucked therewith via an elastic body in a vacuum chamber, to place them opposite to each other and to bond the upper substrate to the lower substrate of which the surface has a sealant and a liquid crystal material applied thereto, and includes a step(SP1) to recognize a position of the mark on the upper substrate, a step(SP2) to recognize a position of the mark on the lower substrate , a step(SP3) to recognize an absolute value of a difference between the positions of the marks of the upper and lower substrates and to judge whether the value is a specified value or not and steps(SP5, 8) to issue a directive to relocate the lower substrate while adding compensation corresponding to deformation of the elastic body in the case in the foregoing step the absolute value of the difference between the positions of the marks of the upper and lower substrates is judged to be not the specified value. COPYRIGHT: (C)2004,JPO
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