| 摘要 |
PROBLEM TO BE SOLVED: To improve a conventional system for etching a printed wiring board such that the etching accuracy is substantially equalized on the upper and lower surface sides of the printed wiring board and the printed wiring board is prevented from warping. SOLUTION: In the method for etching a printed wiring board by spraying etching liquid to the upper and lower surface sides of an exposed printed wiring board being carried horizontally, the etching liquid is sprayed by means of a flat spray or a full-cone spray. The etching liquid is sprayed to substantially identical opposing positions on the upper and lower surfaces of the printed wiring board while reciprocating substantially in parallel with the printed wiring board in a direction perpendicular to the carrying direction thereof on a horizontal plane. Consequently, etching accuracy is substantially equalized on the upper and lower surface sides of the printed wiring board and the printed wiring board is prevented from warping. COPYRIGHT: (C)2004,JPO
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