发明名称 METAL BONDED GRINDING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a metal bonded grinding tool capable of efficiently grinding even a work of largest dimensions in high precision and dispensing with the necessity dressing. SOLUTION: The metal bonded grinding tool comprises a metal bonding material wherein abrasives are dispersively supported and pores are dispersed. The volume distribution ratio of pores is 30% or more on those of 25 micrometer or more diameter, and 55% or less on those of less than 12.5 micrometer diameter, and also the volume porosity is 5-12%. Composition of the bonding material are copper 2-30 % by weight, tin 1-40 % by weight, phosphorus 0.2-3 % by weight, and remaining nickel (50% by weight). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004148469(A) 申请公布日期 2004.05.27
申请号 JP20020318466 申请日期 2002.10.31
申请人 MITSUI KENSAKU TOISHI KK 发明人 SAKAI AKIRA;YAMASHITA KATSUHIKO;ARIMURA TAKUMA
分类号 B24D3/06;B24D3/00;B24D3/10;(IPC1-7):B24D3/06 主分类号 B24D3/06
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