| 摘要 |
PROBLEM TO BE SOLVED: To provide Sn-Zn type lead-free solder formulated to inhibit peeling by suppressing zinc corrosive oxidation in an intermetallic compound and a soldered article having excellent oxidation corrosion resistance. SOLUTION: The lead-free solder is lead-free solder consisting of 5 to 10mass% Zn, 0.005 to 1.0mass% at least one kind selected from Au, Fe, Pt, Pd, and Sb, and consisting of the balance Sn and is formed by adding 0 to 15mass% at least one kind selected from Bi and In to the lead-free solder. The soldered article is formed by soldering electronic parts consisting of Cu in at least one of soldering parts and a printed circuit board. COPYRIGHT: (C)2004,JPO
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