发明名称 |
EDGE-SEALED SUBSTRATE AND METHOD OF OBTAINING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of sealing a multi-layer substrate used in a fluid device. SOLUTION: This method comprises a step of attaching a sealing material having an amount enough for covering an exposed electric mutual connection section (114) to a portion above one or more edges (202) having the exposed electric mutual connection sections (114) on at least one multi-layer substrate (200) to be used in the fluid device in the region smaller than the whole area thereof. The method further comprises a step of exposing the sealing material in a condition effective to seal the electric mutual connection section (114). COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004148816(A) |
申请公布日期 |
2004.05.27 |
申请号 |
JP20030356470 |
申请日期 |
2003.10.16 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT CO LP |
发明人 |
AKHAVIN MOHAMMAD;MARKWELL STANLEY G;HORVATH JANIS;SCHEFFELIN JOSEPH E |
分类号 |
B41J2/01;B41J2/16;H05K1/00;H05K1/03;H05K3/24;H05K3/28;(IPC1-7):B41J2/01 |
主分类号 |
B41J2/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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