| 发明名称 |
Conductive bump structure |
| 摘要 |
The present invention describes a conductive bump structure. This structure comprises a buffer layer. The buffer layer manifests a deformation during bonding process. This deformation may compensate for the height difference among the gold bumps.
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| 申请公布号 |
US2004099959(A1) |
申请公布日期 |
2004.05.27 |
| 申请号 |
US20020301584 |
申请日期 |
2002.11.22 |
| 申请人 |
HANNSTAR DISPLAY CORP. |
发明人 |
TANG PAO-YUN |
| 分类号 |
H01L23/485;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/485 |
| 代理机构 |
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| 地址 |
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