| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for the backlight of a liquid crystal display device in which the wiring space can be increased in the direction orthogonal to the arrangement direction of the LED mount region. <P>SOLUTION: Solder lands 13La, 13Lb, 13Lc, 13Ld are provided with solder fillet forming parts 13Fa, 13Fb, 13Fc, 13Fd, respectively. The end solder lands 13La and 13Ld at either ends in the arrangement direction of the solder lands 13La, 13Lb, 13Lc, 13Ld are provided with the solder fillet forming parts 13Fa and 13Fd, respectively, only in the arrangement direction. The solder lands 13Lb and 13Lc at the inner position excluding the ends in the arrangement direction are provided with the solder fillet part 13Fb and 13Fc, respectively, at one end in the direction orthogonal to the arrangement direction. <P>COPYRIGHT: (C)2004,JPO |
