| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component installation method to a wiring board which reduces man-days, shortens process time, and realizes cost reduction. SOLUTION: This method is characterized by including: a process for forming adhesive agent resin layers 18 on a pad 14 for connection and a pad 16 for installation; a process for temporarily adhering solder particles 20 by scattering them on the pad 14 and the pad 16 by using the resin layer 18; a reflow process for mounting a soldered component 22 on the pad 16, reflowing the solder particles 20, pre-coating a solder thin layer 24 on the pad 14, and mounting the component 22 on the pad 16 via solder; and a flip chip connecting process for positioning and mounting a bear chip 26 on the soldr thin layer 24 of the pad 14, and performing flip chip connection of the bear chip 26. COPYRIGHT: (C)2004,JPO |
