| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment and method therefor which can suck and pick up more safely a die chip on an adhesive sheet. SOLUTION: The semiconductor manufacturing method is provided with a process for absorbing/picking up individually a plurality of chips from the adhesive sheet which are constituted by dividing a wafer every semiconductor circuit which wafer is stuck on the adhesive sheet. A suction stage holds a chip used as an object for absorption/pickup at an absorption/pickup position of a stage central part by sucking the adhesive sheet to be mounted on the upper surface at the time of absorption/pickup of the chip. Before locating the chip at an absorption/pickup position, the stage is set as a suction status. After that, the chip is moved as far as the absorption/pickup position from outside the stage on the suction stage which is already in the suction status. The adhesive sheet is previously exfoliated from the chip used as the object for absorption/pickup. COPYRIGHT: (C)2004,JPO |
