发明名称 CERAMIC CIRCUIT BOARD WITH HEAT SINK AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To prolong the heat cycle life of a ceramic board with a heat sink and, in addition, to satisfactorily maintain the heat radiating characteristic of the heat sink. <P>SOLUTION: First and second aluminum alloy plates 21 and 22 are respectively laminated on and bonded to the both surfaces of a ceramic substrate 13 through first and second Al-based brazing material layers 11 and 12, and a heat sink 45 is laminated upon and bonded to the first or the second aluminum alloy plate 21 or 22. The heat sink 45 is constituted of a copper alloy plate 16, a silica coating layer 46 formed on one surface of the plate 16, and a third aluminum alloy plate 54 laminated upon and bonded to the coating layer 46 through a third brazing material layer 43. The third aluminum alloy plate 54 is directly laminated on and bonded to the first or the second aluminum alloy plate 21 or 22 through a fourth brazing material layer 44. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004152972(A) 申请公布日期 2004.05.27
申请号 JP20020315925 申请日期 2002.10.30
申请人 MITSUBISHI MATERIALS CORP 发明人 NAGASE TOSHIYUKI;NAGATOMO YOSHIYUKI
分类号 B23K1/20;B23K31/02;B23K35/28;B23K101/40;C22C21/00;H01L23/12;H01L23/13;H01L23/36;(IPC1-7):H01L23/36 主分类号 B23K1/20
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